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Silicon Motion SM671PXC-ADS | UFS 2.1 TLC NAND 64GB C-temp
SM671PXC-ADS | UFS 2.1 TLC NAND 64GB C-temp
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31954446-SM671PXC-ADS | UFS 2.1 TLC NAND 64GB C-temp
- EU RoHSCompliant
- ECCN (US)EAR99
- HTS8542.32.00.71
- AutomotiveYes
- PPAPUnknown
- Cell TypeTLC NAND
- Chip Density (bit)512G
- ProgrammabilityYes
- Timing TypeSynchronous
- Interface TypeSerial UFS
- Minimum Operating Temperature (°C)-25
- Maximum Operating Temperature (°C)85
- Supplier Temperature GradeCommercial
- Command CompatibleYes
- ECC SupportYes
- Support of Page ModeYes
- MountingSurface Mount
- Package Height1.2
- Package Width11.5
- Package Length13
- PCB changed153
- Supplier PackageBGA
- Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tray - Pin Count
a count of all of the component leads (or pins)
153 - Boot BlockNo
Quantity
Unit Price
Ext. Price
1+
$275.262293
$275.27
10+
$259.681429
$2,596.76
100+
$244.982497
$24,498.20
500+
$231.115498
$115,557.74
1000+
$218.033517
$218,033.49
* The above prices does not include taxes and freight rates, which will be calculated on the order pages.
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